Silicone Resin Factory&supplier
Silicone Resin
Everything you need to know about our products and company
Basic Product Information
Chemical Properties
High Si-O bond energy (452 kJ/mol) enables long-term service at 200–300°C, with some grades tolerating higher temperatures without decomposition.
Stable molecular structure resists acids, alkalis, and solvents (tested per ASTM D543 at 10% concentration for 168h), providing substrate protection.
Maintains performance stability in oxidative environments due to inert siloxane backbone (O₂ exposure tests show <5% property change after 1000h at 150°C).
Contains hydroxyl/vinyl groups (typically 2–5 wt%) for crosslinking customization, allowing property optimization via:
Hydrosilylation
Condensation curing
Free radical reactions
Physical Properties
Liquid (viscosity 50–10,000 mPa·s at 25°C)
Solid (powder: 20–100 μm; pellets: 1–3 mm)
Compatible with toluene, xylene, and ketones (solubility ≥30 wt%), facilitating coating formulations.
Dielectric constant: 2.6–3.2 (1 MHz, ASTM D150)
Volume resistivity: >10¹⁵ Ω·cm (IEC 60093)
Surface tension: 20–24 mN/m (vs. water’s 72 mN/m) ensures superior substrate wetting (contact angle <10° on metals).
Cured characteristics adjustable via formulation:
Hardness: Shore A 20–90 (ASTM D2240)
Elongation: 50–300% (ASTM D412)
Taber abrasion: <50 mg/1000 cycles (CS-10 wheel, 1kg load)
Product Functions
Applications
Core Advantages
Advantages | Technical Parameters | Industry Value |
Ultra-high electrical insulation | Volume resistivity ≥ 10¹⁵ Ω·cm, dielectric constant ≤ 3.0 (at 1 MHz) | Ensures the safe and stable operation of electronic devices, reduces the risk of electric leakage, and is suitable for various high-precision electronic devices and high-voltage electrical systems. |
Excellent thermal stability | Long-term operating temperature range from -50°C to 250°C, and some can reach above 300°C | Meets the working requirements of electronic and electrical devices in high-temperature environments, reduces device failures caused by thermal failure, and extends the service life of devices. |
Outstanding moisture resistance | Water absorption rate ≤ 0.5% (after 24-hour immersion) | Effectively resists the erosion of moisture on electronic components, ensures the normal operation of electronic devices in a humid environment, and improves the reliability and stability of devices. |
Good chemical stability | Resistant to 10% acid, 10% alkali, and common organic solvents (no obvious corrosion after 168 hours) | Suitable for the protection of electronic and electrical devices in harsh environments such as the chemical and marine industries, and reduces equipment maintenance costs. |
Low-stress characteristics | Curing shrinkage rate ≤ 2% | During the electronic packaging process, effectively reduces the stress generated by thermal expansion and contraction, protects electronic components from stress damage, and improves the reliability of packaging. |
Market Value
Temperature Resistance Range: -60°C to 300°C (short-term resistance to 500°C)
Dielectric Strength: >20 kV/mm (1mm thickness)
Volume Resistivity: >10¹⁵ Ω·cm (at 200°C)
Dielectric Constant (1MHz): 2.8–3.2
Dissipation Factor: <0.002
Arc Resistance: >180 seconds (ASTM D495)
Viscosity Adjustment Range: 500–50,000 cP (25°C)
Diverse Curing Methods: Thermal/UV/moisture curing
Adhesive Strength with Metal/Ceramic: >10 MPa
Global Power Electronics Market CAGR: 9.8% (2023–2028)
5G Base Station Construction Density Increase: 30–50%
High-voltage System Voltage Platform in Electric Vehicles Upgraded to 800V+
Substitution Space for Traditional Epoxy Resins: $3.5B (2025)
Premium Pricing Capability for High-end Products: 40–60%
Promotion Driven by Halogen-free Material Regulations
Device Lifespan Extended by 2–3 Times
System Energy Consumption Reduced by 15–20%
Maintenance Costs Decreased by 30–40%
Experimental Data and Case Studies
Experimental Data
Test Item | Test Conditions | Results | Benchmark Comparison |
Insulation Performance | High-Voltage Breakdown Test (20kV) | No breakdown, no leakage | Standard epoxy resin: Breakdown at 15kV |
Moisture & Heat Resistance | 85°C/85%RH, 1000h | No delamination, no degradation | Polyurethane coating: Failed at 500h |
Thermal Conductivity | Thermal conductivity 0.2 W/(m·K) | Better than standard materials | Traditional materials: 0.1 W/(m·K) |
Case Studies
Issue: Traditional insulation materials degrade easily in high-temperature, high-humidity environments, leading to cable failures.
Solution: Applied silicone resin insulation coating.
Result: Cable lifespan extended to 20 years, with 80% reduction in failure rate.
Requirement: Address LED brightness decay caused by UV exposure and high temperatures.
Solution: High-transparency silicone resin encapsulation.
Effect: >95% brightness retention after 5 years, far exceeding industry standards.
Issue: Battery packs prone to short circuits under high temperatures.
Solution: Flame-retardant silicone resin encapsulation (oxygen index ≥30%).
Effect: Flame resistance extended to 20 minutes, significantly surpassing national standards.
Preparation Process, Core Technologies, and Precautions
Ultra-Pure Preparation Process System
Breakthrough Core Technologies
Precautions
Packaging & Ordering
Packaging: 200kg/1000kg plastic drums (customizable).
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Basic Product Information Product Name: Silicone Resin Chemical Name: Polysiloxane Appearance: Colorless Transparent Liquid Chemical Properties Ultra-Low Surface Energy: Surface tension of 18–22 mN/m, enabling exceptional release performance. Thermal Stability: Continuous heat resistance up to 300°C; instantaneous tolerance to 500°C. .
Basic Product Information Product Name: Silicone Resin Chemical Name: Polysiloxane Appearance: Colorless Transparent Liquid Chemical Properties Excellent Thermal Stability: The high bond energy of Si-O-Si enables long-term resistance to temperatures of 200–300°C, with some variants capable of withstanding even higher temperatures. Minimal.
Basic Product Information Product Name: Silicone Resin Chemical Name: Polysiloxane Appearance: Colorless Transparent Liquid Chemical Properties SILICONE RESIN Exceptional Thermal Stability: High Si-O bond energy enables long-term resistance to 200–300°C and short-term tolerance above 350°C, significantly enhancing the heat resistanc.
Basic Product Information Product Name: Silicone Resin Chemical Name: Polysiloxane Appearance: Colorless Transparent Liquid Chemical Properties High-Temperature Resistance: Si-O bond energy: 452 kJ/mol Long-term thermal stability: 250–300°C Short-term tolerance: Up to 500°C Chemical Inertness: Resistant to acids, alkalis.