Silicone Resin

Silicone resins provide essential dielectric protection and thermal stability for electronic components. These materials offer reliable insulation (-50°C to 200°C operation) with low signal loss characteristics.

Featuring UL 94 V-0 flame resistance and superior moisture protection, they safeguard sensitive circuits in consumer and automotive applications. Their flexible formulation prevents cracking during thermal cycling while maintaining performance in harsh conditions.

Compatible with automated manufacturing processes, these resins deliver efficient production solutions that meet international electronic standards for next-generation devices.

Basic Product Information

• Product Name: Silicone Resin
• Chemical Name: Polysiloxane
• Appearance: Colorless Transparent Liquid

Chemical Properties

• Excellent Thermal Stability:

High Si-O bond energy (452 kJ/mol) enables long-term service at 200–300°C, with some grades tolerating higher temperatures without decomposition.

• Chemical Resistance:

Stable molecular structure resists acids, alkalis, and solvents (tested per ASTM D543 at 10% concentration for 168h), providing substrate protection.

• Oxidation Resistance:

Maintains performance stability in oxidative environments due to inert siloxane backbone (O₂ exposure tests show <5% property change after 1000h at 150°C).

• Reactive Functionality:

Contains hydroxyl/vinyl groups (typically 2–5 wt%) for crosslinking customization, allowing property optimization via:

Hydrosilylation

Condensation curing

Free radical reactions

Physical Properties

• Versatile Forms:

Liquid (viscosity 50–10,000 mPa·s at 25°C)

Solid (powder: 20–100 μm; pellets: 1–3 mm)

• Solubility:

Compatible with toluene, xylene, and ketones (solubility ≥30 wt%), facilitating coating formulations.

• Electrical Insulation:

Dielectric constant: 2.6–3.2 (1 MHz, ASTM D150)

Volume resistivity: >10¹⁵ Ω·cm (IEC 60093)

• Low Surface Energy:

Surface tension: 20–24 mN/m (vs. water’s 72 mN/m) ensures superior substrate wetting (contact angle <10° on metals).

• Tunable Mechanical Properties:

Cured characteristics adjustable via formulation:

Hardness: Shore A 20–90 (ASTM D2240)

Elongation: 50–300% (ASTM D412)

Taber abrasion: <50 mg/1000 cycles (CS-10 wheel, 1kg load)

Product Functions

• Improve Insulation Performance: Significantly enhances the insulation rating of electronic components, ensuring safe operation of equipment in high-voltage and high-temperature environments.
• Enhance Weather Resistance: Effectively withstands environmental factors such as ultraviolet rays and moisture, prolonging the service life of electronic devices.
• Optimize Heat Dissipation: Some silicone resins have thermal conductivity properties, which help dissipate heat from electronic components and improve stability.
• Protection and Encapsulation: Provides reliable encapsulation protection for circuit boards, chips, etc., preventing physical damage and chemical corrosion.

Applications

• Semiconductor Packaging: Used for chip encapsulation, providing high insulation and high-temperature resistance.
• High-voltage Cable Insulation: Improves the insulation rating and weather resistance of cables, suitable for the power transmission field.
• Electronic Component Coating: Protects components such as circuit boards and capacitors from moisture, corrosion, and high temperatures.
• LED Encapsulation: Features high light transmittance and UV resistance, ensuring long-term stable light emission of LEDs.
• New Energy Battery Protection: Used as fire-resistant insulating coatings for lithium batteries and fuel cells, improving safety.

Core Advantages

Market Value

• Core Performance Value Dimensions
• Extreme Environment Stability:

Temperature Resistance Range: -60°C to 300°C (short-term resistance to 500°C)

Dielectric Strength: >20 kV/mm (1mm thickness)

Volume Resistivity: >10¹⁵ Ω·cm (at 200°C)

• Electrical Reliability:

Dielectric Constant (1MHz): 2.8–3.2

Dissipation Factor: <0.002

Arc Resistance: >180 seconds (ASTM D495)

• Process Adaptability:

Viscosity Adjustment Range: 500–50,000 cP (25°C)

Diverse Curing Methods: Thermal/UV/moisture curing

Adhesive Strength with Metal/Ceramic: >10 MPa

• Market Driver Matrix
• Technical Upgradation Demand:

Global Power Electronics Market CAGR: 9.8% (2023–2028)

5G Base Station Construction Density Increase: 30–50%

High-voltage System Voltage Platform in Electric Vehicles Upgraded to 800V+

• Material Substitution Trends:

Substitution Space for Traditional Epoxy Resins: $3.5B (2025)

Premium Pricing Capability for High-end Products: 40–60%

Promotion Driven by Halogen-free Material Regulations

• Economic Benefits:

Device Lifespan Extended by 2–3 Times

System Energy Consumption Reduced by 15–20%

Maintenance Costs Decreased by 30–40%

Experimental Data and Case Studies

Experimental Data

Case Studies

• High-Voltage Cable Insulation Coating

Issue: Traditional insulation materials degrade easily in high-temperature, high-humidity environments, leading to cable failures.

Solution: Applied silicone resin insulation coating.

Result: Cable lifespan extended to 20 years, with 80% reduction in failure rate.

• LED Encapsulation Material

Requirement: Address LED brightness decay caused by UV exposure and high temperatures.

Solution: High-transparency silicone resin encapsulation.

Effect: >95% brightness retention after 5 years, far exceeding industry standards.

• New Energy Vehicle Battery Module Encapsulation

Issue: Battery packs prone to short circuits under high temperatures.

Solution: Flame-retardant silicone resin encapsulation (oxygen index ≥30%).

Effect: Flame resistance extended to 20 minutes, significantly surpassing national standards.

Preparation Process, Core Technologies, and Precautions

Ultra-Pure Preparation Process System

• Catalytic Synthesis System:
• Platinum-based nanocatalysts (particle size 2-5 nm, 50-100 ppm)
• Supercritical CO₂ reaction medium (35 MPa, 60°C)
• Microchannel continuous flow process (liquid holdup <50 mL)
• Deep Purification Technology:
• Molecular distillation (residual pressure <1 Pa)
• Combined ion exchange-chelating (Na⁺ <0.1 ppb)
• Ultrafiltration system (10-100 nm)
• Nanocomposite Technology:
• In-situ surface modification
• Ultrasonic-high pressure synergistic dispersion
• Directional assembly process

Breakthrough Core Technologies

• Dielectric Regulation Technology:
• Adjustable dielectric constant range (2.8-4.5)
• Dielectric loss control (<0.002)
• Space charge suppression
• Interface Engineering:
• Metal/ceramic surface coupling
• Nanoscale interfacial transition layer
• Stress buffer structure
• Reliability Enhancement:
• Electrical treeing inhibition
• Partial discharge protection
• Aging failure预警 (Note: “预警” is typically translated as “early warning” or “failure prediction”)

Precautions

• Storage: Keep in a cool, sealed environment at 5-25°C, shelf life 12 months.
• Safety: Wear N95 masks and goggles during operation, ensure adequate ventilation.

Packaging & Ordering

Packaging: 200kg/1000kg plastic drums (customizable).